Electronic packaging device with insertable leads and method of manufacturing

ABSTRACT

A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The invention relates generally to non-semiconductor electricaland electronic components used in printed circuit board applications andparticularly to an improved package and method of packaging miniatureelectronic components.

[0003] 2. Description of Related Technology

[0004] Dual in-line chip carrier packages (DIPs) are well known in thefield of electronics. A common example of a DIP is an integratedcircuit, which is typically bonded to a ceramic carrier and electricallyconnected to a lead frame providing opposed rows of parallel electricalleads. The integrated circuit and ceramic carrier are normally encasedin a black, rectangular plastic housing from which the leads extend.

[0005] The continuing miniaturization of electrical and electroniccomponents and high density mounting thereof have created increasingchallenges relating to electrical isolation and mechanicalinterconnection. In particular, substantial difficulty exists inestablishing reliable and efficient connections between fine gauge (AWG24 to AWG 50) copper wire leads associated with various electroniccomponents within a given DIP. One particularly useful prior art methodof packaging and connecting element leads to the lead frame terminalsor, of interconnecting the leads of two or more electronic components,is disclosed in U.S. Pat. No. 5,015,981, which is illustrated herein inFIG. 1. Commonly known as “interlock base” technology, this methodinvolves routing the wire lead(s) 2 to an unused lead frame slot orchannel 3 located at the edge of the non-conducting base member 10, asshown in FIGS. 1 and 2. Each of these channels 3 is designed to receivea single conductive lead frame terminal 4, which when assembled assertsan inward bias on the package thereby forcing contact between theconductive terminals 4 of the lead frame and the electronic componentlead(s) 2. This method typically utilizes a locking mechanism, such as asmall tab 12 or extension on the four corner lead terminals 14, 15, 16,17, which locks into a plastic protrusion 18 of similar dimensions usingthe spring tension associated with the individual lead terminals 4 ofthe lead frame 34. The device is ultimately encapsulated within anover-molding to complete the package.

[0006] Disabilities associated with aforementioned interlock base designinclude the requirement to encapsulate or over-mold the package, whichadds labor and cost to the product, as well as the production ofunwanted mechanical and/or thermal stresses upon the electroniccomponents and their associated conductors contained within the packagedue to the encapsulant. Furthermore, the electrical performance of thedevice may be less than that of a comparable “open” design as describedbelow, due again primarily to the presence of the encapsulant.

[0007] A second approach to miniature electronic device packaging hasbeen the so-called “open header” design and is illustrated in FIG. 4. Inthis design, the individual lead terminals 50 of the lead frame aremolded directly into a non-conductive base member 52 when the latter isformed. The leads each include a terminal pin 54 which projects from thebase 52, thereby allowing the conductors 56 of the electroniccomponent(s) 58 of the device to be routed to and wound around (orotherwise bonded to) the terminal pins 54 as required. No encapsulationor over-molding of the assembled device is performed (hence the name“open”, referring to the open bottom of the package.)

[0008] However, the aforementioned open header design suffers fromvarious disabilities as well. First, excess material or “flash”associated with the molding of the non-conducting base member isdifficult to trim due to the presence of the molded-in lead frame andterminal pins as shown in FIGS. 3 and 4. Specifically, prior arttechniques of de-flashing, which typically comprise the use of sand,polymers, or another particulate abrasive sprayed at high pressure tomechanically remove the flash, undesirably damage or affect other nearbycomponents such as the lead frame and terminal pins, therebynecessitating re-plating thereof. Obviously, such re-plating introducesadditional cost into the manufacturing process.

[0009] Second, the use of the aforementioned abrasives tends to removeportions of the surface layer of the molded base member in areasadjacent to the lead frame. This is significant since in many typicalconstructions, glass or other fibers are used to strengthen or reinforcethe polymer used to form the base element. Such removal of the surfacelayer allows for unwanted absorption by the exposed fiber matrix ofimpurities and/or moisture which can affect both the mechanical andelectrical properties of the base member and the package as a whole, aswell as its longevity. Such removal also detracts from the esthetics ofthe package, giving it an unfinished or damaged appearance.

[0010] Lastly, prior art methods of installing the lead frame on thebase member and bonding the conductors of the packaged components to thelead frame make trimming of the free ends of the conductors afterbonding difficult, in that they are not necessarily uniform, and do notprovide a surface which readily permits such trimming.

[0011] Based on the foregoing, it would be highly desirable to providean improved apparatus and method for connecting a lead frame to apackage of any size such that the molded package could be easilyde-flashed and prepared without damaging or requiring additionalprocessing of the base member or related components such as the leadframe. Additionally, such an improved apparatus and method wouldfacilitate trimming of the free conductor ends, thereby reducing processlabor and associated cost. Ideally, no encapsulation of the device wouldbe required, thereby further reducing manufacturing costs, andeliminating the possibility of deleterious effects on device performanceand longevity associated with the use of an encapsulant.

SUMMARY OF THE INVENTION

[0012] The invention satisfies the aforementioned needs by providing animproved electronic component package and interconnect device having aplurality of specially shaped insertable leads and corresponding leadchannels which receive the leads.

[0013] In a first aspect of the invention, an improved electronic deviceis disclosed which includes a base body with at least one side wallwhich is fabricated from non-conductive material and includes at leastone electronic component recess and a plurality of specially shaped leadchannels formed in the at least one side wall. The lead channels have atleast one retention element comprising at least a projection thatreduces the cross-sectional area of the lead channel. The device alsoincludes at least one electronic component disposed in the recess, withthe electronic component having a plurality of lead wires, with at leastone of the lead wires extending within one of the lead channels. Thelead channels are adapted to receive respective ones of insertable leadterminals, wherein each of the lead terminals comprises a clip regionwith substantially a U-shape, this shape enabling the clip region tofrictionally connect the lead terminal to the respective lead channeland forming a conductive contact with one of the lead wires.

[0014] In a second aspect of the invention, an improved method forfabricating the aforementioned device is disclosed. In one embodiment ofthe method, the base member is formed from a non-conductive materialusing a transfer molding process. The electronic component(s) are alsoformed. The molded base member is de-flashed using a de-flashing toolwhile the lead terminals are formed and pre-shaped for simultaneousinsertion into the lead channels of the base member. After de-flashing,the electronic components are placed within the base member, and theconductors routed into the lead channels thereof. Next, the leadterminals are inserted into the lead channels such that the terminalsform an electrical contact with the conductors in the respectivechannels, and the contact is bonded using dip soldering or anotherbonding process. Lastly, the die bar or carrier joining the leadterminals is trimmed, and any excess conductor length is trimmed aswell. The device may also optionally be encapsulated in a polymer orother over-molding if desired.

[0015] These and other objects and features of the invention will becomemore fully apparent from the following description and appended claimstaken in conjunction with the following drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016]FIG. 1 is a perspective view of a prior art microelectronicpackaging device illustrating the relationship between the leadterminals and lead channels.

[0017]FIG. 2 is perspective view of the prior art device of FIG. 1,illustrating the electrical interconnection between the component leadand lead terminals within a single lead channel, and the lockingmechanism associated therewith.

[0018]FIG. 3 is a perspective view of a typical prior art open headerpackage design.

[0019]FIG. 4 is a e cross-sectional view of the open header package ofFIG. 3 taken along line 4-4 of FIG. 3.

[0020]FIG. 5a is a perspective view of one exemplary embodiment of thebase member and associated lead terminals of the invention

[0021]FIG. 5b is a bottom perspective view of the device of FIG. 5a.

[0022]FIG. 6 is side plan view of the lead terminals of the embodimentof FIG. 5a.

[0023]FIG. 7 is a top plan view of the lead terminals of the embodimentof FIG. 5a prior to detachment from the die bar.

[0024]FIG. 8 is a perspective cross-sectional view of the base member ofFIG. 5a taken along line 8-8 of FIG. 5a.

[0025]FIG. 9 is a side cross-sectional view of the assembled device,taken along line 9-9 of FIG. 5a, illustrating the placement of theelectronic components and associated conductors with respect to the basemember and lead terminals

[0026]FIG. 10a is an exploded perspective view of a second embodiment ofthe device of the invention, adapted for use in an RJ style connector.

[0027]FIG. 10b is a side cross-sectional view of the device of FIG. 10ataken along line 10 b-10 b.

[0028]FIG. 11 is a logical flow chart illustrating one exemplaryembodiment of a method of manufacturing the electronic device of theinvention.

DETAILED DESCRIPTION OF THE INVENTION

[0029] Reference is now made to the drawings wherein like numerals referto like parts throughout.

[0030]FIGS. 5a and 5 b illustrate a first embodiment of the base member100 with a set of lead terminals 102 according to the invention. Asillustrated in the aforementioned figures, the base member 100 iscomprised generally of a three-dimensional base body 104 having one ormore electronic component recesses 106 formed at least partly therein.The body 104 includes a top wall 110, side walls 112 a-112 d, and abottom wall 114. The body 104 also includes a plurality of sets of leadchannels 116 formed vertically within the side walls 112 of the body 104as described in greater detail below, although other orientations may beused. The base body 104 is ideally fabricated from a non-conductivematerial such as a liquid crystal polymer using an injection moldingprocess or alternatively a transfer molding process, although othermaterials and processes may be used.

[0031] The electronic component recesses 106 are shaped to receive anyone of a variety of different electronic components 107 (not shown),such as toroidal induction coils. While the discussion presented hereinis specific to the illustrated toroidal induction coils, it can beappreciated that a variety of different electronic components may beused in conjunction with the invention with equal success.

[0032] The lead channels 116 are disposed on the opposing, elongate sidewalls 112 a, 112 c of the base body, and oriented in a verticaldirection such that the channels 116 run generally from the bottom wall114 toward the top wall 110, and are parallel to one another. Thisorientation facilitates the routing of wire leads associated with theelectronic components disposed in the recesses 106 into the leadchannels 116 when the packaging device is assembled as will be discussedbelow.

[0033] Referring now to FIG. 6, the structure of one exemplaryembodiment of the lead terminals 102 of the invention is described. Inthe illustrated embodiment, the lead terminals 102 have a generallyrectangular cross-section, although other cross-sectional shapes can beused.

[0034] Each lead terminal 102 is formed to its final desired shape bybending the distal region 132 of each lead terminal 102 such that aclip-like portion 134 is formed. This clip-like portion 134 is used toprovide mechanical attachment to the lead channel 116 as discussed ingreater detail below. The bent distal region 132 also comprises acounter-bend 140. This construction helps provide some degree ofmechanical resilience or “spring” to the lead terminal 102 such that thecompression of the lead terminal 102 by various portions of the basemember 100 as described below when the former is inserted into thelatter assists in maintaining friction between the lead terminal 102 andbase member 100. This friction between the lead terminal 102 and basemember 100 helps frustrate the removal of the lead terminal 102 from thebase member 100 even when there is no use of adhesives or fasteners,which is desirable.

[0035] As shown in FIG. 7, the lead terminals 102 are initially part ofa larger die bar assembly 130 before being separated therefrom duringmanufacturing. The use of a die bar assembly 130 allows all of the leadterminals 102 to be formed and placed within their respective leadchannels 116 in single processing steps, as is described further below.The lead terminals 102 are attached to the die bar 130 at one end 126,and are generally coplanar with each other to facilitate easy insertioninto the base member 100 as described further below. The lead terminals102 are scored or notched at a point 131 near the bent region 132 so asto permit easy separation of the lead terminal 102 from the die barassembly 130. A contact end 142 (i.e., after separation of the leadterminal 102 from the die bar assembly 130 at the score 131) contactsthe contact pads or traces on the PCB (not shown) or other substrate towhich the device is mounted. The die bar 130 (and attached leadterminals 102) of the present embodiment are fabricated from anelectrically conductive metal alloy, although other materials mayconceivably be used.

[0036] Referring now to FIG. 8, the construction of the lead channels116 within the base member 100 is described. Each lead channel 116comprises a longitudinal aperture 150 which is vertically oriented withrespect to the side walls 112 of the base member 100. The channels 116further comprise a wall element 152 which spans each aperture 150transversely to a predetermined height within the aperture 150 such thata wall or barrier between the recess 106 and the region outside of thebase member 100 is formed. Ridge elements 156 a, 156 b (not shown) areformed over each of these wall elements 152 at the outer edges of theaperture 150 and in a direction parallel to the longitudinal axis of theaperture 150 such that the ridge elements 156 are roughly coextensivewith the length of the outer surface of the wall element 152, bothinside and outside of the device. Ridge elements 156 a and 156 b createa chamfered region adjacent to the wall element 152 that facilitates therouting of lead wires 109 as will be discussed below.

[0037] A retainer 160 is formed adjacent the bottom surface of the sidewall 112 between the lead channels 116 and connected to the wallelements 152. The retainer element 160 further includes lateralprojections 162 which help capture and retain the lead terminals 102(not shown) within the lead channels 116 by reducing the effectivecross-sectional area of each lead channel 116 as viewed from the outsideof the base member 100. Each retainer 160 with lateral projections 162forms a “T” shape projecting outward from the base member 100. Hence,the retainer 160 with lateral projections 162, lead channels 116, wallelement 152, and ridge elements 156 cooperate to receive the clip-likeportion 134 of the lead terminals 102 and rigidly capture it within thebase member 100.

[0038] As illustrated in FIG. 9, the lead wires 109 associated with theelectronic component 107 are routed in the lead channels 116 such thateach lead wire 109 runs up one side 170 of the wall element 152 and downthe opposing side 172 substantially between the two ridge elements 156a, 156 b (not shown), and with the distal (untrimmed) end 174 of thelead wire 109 emerging from the upper end 176 of the lead channel 116.In this fashion, the lead wire 109 is firmly held within the leadchannel 116 and securely contacted by the clip-like portion 134 of therespective lead terminal 102 when the latter is installed into the basemember 100, thereby forming an electrical contact. Note that the leadterminals 102 may be bonded in place if desired, held by frictionagainst the base member 100 such as by forming the retainer 160 in atapered shape, or attached using any other means available.

[0039] It is also noted that the cooperation of the side walls 112 a,112 c of the base member 100, the inserted lead terminals 102, and thelead channels 116 form a convenient location 184 on the outer surface ofthe base member 100 at which excess lead wire 109 associated with theelectronic components 107 may be trimmed during manufacturing.

[0040] While the aforementioned description has been provided in termsof the exemplary embodiment illustrated in FIGS. 5a-9, it will berecognized that numerous other configurations are possible, depending onthe needs of the user. For example, the base member 100 and associatedretainer 160, aperture 150, wall member 152, and ridges 156 couldreadily be adapted to receive lead terminals having a circular or ovalcross-section. Alternatively, the clip-like portion 134 could bereplaced with a simple U-shaped bend with counter-bend (not shown) whichcorresponds closely with the cross-section of the wall member 152, yetwhich has sufficient friction to assist in retaining the lead terminal102 mounted thereon. As yet another alternative, the lead terminalscould be formed such that the contact region 142 of each lead terminalis disposed at the top of the package (i.e., the package is adapted tobe mounted inverted, or recess-up, on the PCB). As even a furtheralternative, multi-part lead terminals could be used in conjunction withthe base member. Other alternative configurations are possibleconsistent with the concept of inserting captured lead terminals withinlead channels of a base member consistent with the invention, suchalternative configurations being understood by those of skill in theart.

[0041] Referring now to FIGS. 10a and 10 b, an alternative embodiment ofthe device of the invention is described. In this embodiment, the deviceis adapted to be received within an RJ type electronic connector 200 ofthe type well known in the telecommunications art. The lead terminals201 of this embodiment of the device package 202 are deflected at theirends 203 to be more co-linear with the vertical side walls 112 a, 112 cof the base member 100, thereby facilitating easy insertion of thedevice into the connector 200 as shown in FIG. 10a. The spring forceassociated with the compression of the ends 203 of the lead terminals201 upon insertion assists in maintaining the device firmly within therecess. This also allows the device to be “plug-in” rather thanrequiring a solder or other joint to make the electrical connectionbetween the lead terminals 201 and the terminals 205 inside theconnector.

[0042] Note also that the orientation of the device within the connectormay be altered from that shown in FIG. 10a. For example, thelongitudinal dimension 210 of the package 202 may be made normal to theplane of the circuit board (PCB) 212 so as to minimize connectorfootprint. Alternatively, the lead terminals 201 may be formed in theopposite direction of that shown, such that the device can be pluggedinto the connector 200 with the electronic component recess 214 facinginward toward the connector as opposed to outward as in FIG. 10a. As yetanother alternative, the lead terminals 201 of this or other embodimentsmay be notched or otherwise adapted to receive component conductorswound around the terminals 201 as is well known in the art. Many othersuch alternative embodiments are possible, all considered to be withinthe scope of the invention disclosed herein.

[0043] Method of Manufacturing

[0044] The method of assembling the exemplary electronic packagingdevice illustrated in FIGS. 5a-9 herein is now described with referenceto FIG. 11. In the first process step 302 of the method 300, the basemember 100 is formed using processes well understood in the art. Forexample, the base member 100 may be formed using an injection ortransfer molding process. Many different methods of forming thesecomponents are known and may be used with equal success. Next, in step304, the base member 100 is de-flashed after molding using a de-flashingtool of the type well known in the art. Such de-flashing may be donemanually (e.g., by hand) or automatically as desired.

[0045] In step 306, the electronic component(s) 107 are formed usingprocesses well understood in the art. For example, the cores of thetoroidal electronic components formed from a metal alloy suspended in aceramic binder using a sintering and firing process. Many differentmethods of forming these components are known and may be used with equalsuccess.

[0046] In step 308, the number of lead terminals 102 required for use inthe device is determined based on the size and properties of the basemember 100 molded in step 302, and the appropriate number of leadspartitioned. Note that while the method described herein relates to theuse of a plurality of lead terminals 102 being connected to the die bar130 (prior to separation therefrom), the lead terminals may be formedand/or placed within the base member 100 individually or in subsets ofany desired size. In step 310, the lead terminals 102 are formed andscored as previously described to form, inter alia, the clip-likeportion 134 which permits attachment to the base member 100.

[0047] In step 312, the electronic component(s) 107 are placed withinthe recesses 106 formed within the base member 100. A silicone gel orother adhesive of a type well known in the electronic arts mayoptionally be used to aid in retaining the components 107 in theirrecesses 106 during subsequent processing. The lead wires 109 of theelectronic components 107 are then routed into the lead channels 116 inthe next step 314, as illustrated in FIG. 9.

[0048] In the next step 316, the formed lead terminals 102 with die bar130 are inserted into the lead channels 116 of the base member 100 inthe proper orientation, and the lead terminals 102 are captured withintheir respective lead channels 116 by, inter alia, the action of theclip-like portion 134 of each lead terminal 102 and the cooperation ofother components associated with the base member 100 (including theretainer 160 and lateral projections 162) as previously described. Whenthe lead terminals 102 are captured within the lead channels 116 of thebase member 100, the electrical lead wires 109 of the electroniccomponents 107 are captured as well, thereby forming an electricalcontact between each routed conductor and its respective lead terminal102. The lead terminals 102 and the conductors are then optionallybonded, preferably such as by a dip soldering process, in step 318. Itwill be recognized, however, that other types of bonding includingadhesives, crimp bonds, conductor winding, and/or fusion with laserenergy may be substituted.

[0049] When the aforementioned solder process is completed, the flux isthen optionally cleaned with an isopropyl alcohol using an ultrasoniccleaner or comparable means per step 320. The excess portions 181 of thelead wires 109 are then trimmed at the previously identified locations184 as necessary in step 322. By virtue of each of the plurality oftrimming locations 184 being aligned along the side walls of the basemember 100, trimming of all of the lead wires 109 is readily performedsimultaneously. Lastly, in step 324. The lead terminals 102 are severedfrom the die bar 130 at the score point 131 to form the contact regions142 which mate with the PCB or other substrate.

[0050] It will be recognized that while the aforementioned method 300 isdescribed in terms of a specific sequence of steps, the order of certainof these steps may be permuted if desired. For example, while the method300 of FIG. 11 first forms and de-flashes the base member 100 prior toforming the lead terminals 102, the order of these two operations may bereversed. Similarly, the formation of the base member, lead terminals,and electronic components may occur either in series, parallel, or anycombination thereof. Additionally, it is noted that other process stepsmay be added, such as for inspection and/or testing of certaincomponents, and other steps optionally deleted (such as those relatingbonding the lead wires 109 and lead terminals 102 together). Many suchpermutations and combinations are possible, all being considered withinthe scope of the present invention.

[0051] While the above detailed description has shown, described, andpointed out the fundamental novel features of the invention as appliedto various embodiments, it will be understood that various omissions,substitutions, and changes in the form and details of the device orprocess illustrated may be made by those skilled in the art withoutdeparting from the spirit or essential characteristics of the invention.The described embodiments are to be considered in all respects only asillustrative and not restrictive. The scope of the invention is,therefore, indicated by the appended claims rather than by the foregoingdescription. All changes which come within the meaning and range ofequivalence of the claims are to be embraced within their scope.

What is claimed is:
 1. An electronic device, comprising; anon-conducting base body having: at least one side wall, wherein aportion of said at least one side wall defines a plurality of leadchannels in said side wall; a portion of the base body defining at leastone recess disposed therein; at least one retention element disposed inat least one of said plurality of lead channels; at least one electroniccomponent disposed in said at least one recess, said electroniccomponent having a plurality of wire leads, at least one of saidplurality of wire leads extending within at least one of said pluralityof lead channels; a plurality of insertable lead terminals, each of saidlead terminals received within a respective one of said plurality oflead channels, at least one of said lead terminals forming a conductivecontact with said at least one of said plurality of wire leads; andwherein movement of said lead terminals within said plurality of leadchannels is restricted by said retention element.
 2. The electronicdevice of claim 1, wherein each of the lead terminals comprises a clipregion, said clip region forming a shape enabling said clip region tofrictionally connect said lead terminal to the respective lead channel.3. The electronic device of claim 2, wherein the clip region is formedby a substantially U-shape bend in the lead terminal.
 4. The electronicdevice of claim 2, wherein at least one of the lead terminals secures atleast one wire lead in the respective lead channel.
 5. The electronicdevice of claim 1, wherein each retention element comprises at least oneprojection, said projection reducing the cross-sectional area of therespective lead channel.
 6. The electronic device of claim 1, whereinthe base body further defines at least one chamfered notch within saidbase body, said at least one chamfered notch forming a passage betweenan inner side of the at least one side wall and an outer side of saidside wall, said chamfered notch being adapted to receive at least one ofthe wire leads.
 7. The electronic device of claim 1, wherein each ofsaid plurality of lead channels is parallel to one another.
 8. Theelectronic device of claim 1, wherein said base body and said at leastone electronic component are encapsulated in a non-conductive material.9. The electronic device of claim 1, wherein said base body is formedfrom a high temperature liquid crystal polymer.
 10. An electronic devicebase member, comprising: a non-conducting base body having at least oneside wall; a portion of the base body defining a recess disposed atleast partly within the base body; said recess being adapted to receivean electrical component; a portion of the at least one side walldefining a plurality of lead channels disposed substantially on the atleast one side wall, at least one of said lead channels being adapted toreceive an insertable lead terminal; and at least one retention element,at least a portion of said at least one retention element being disposedwithin said at least one lead channel, said at least one retentionelement preventing said lead terminal from moving substantially in afirst direction within said at least one lead channel when said leadterminal is received therein.
 11. The base member of claim 10, whereinsaid at least one retention element comprises at least one projection,said projection reducing the cross-sectional area of the respective leadchannel.
 12. The base member of claim 10, wherein said base bodycomprises a generally rectangular box-like form.
 13. The base member ofclaim 10, further defining at least one chamfered notch disposed withinsaid base member, said at least one chamfered notch forming a passagebetween an inner side of one of the side walls and an outer side of saidside wall, wherein said chamfered notch is adapted to receive at leastone of wire lead of the electrical component.
 14. The base member ofclaim 13, wherein said base member is chamfered on a bottom surface ofthe chamfered notch.
 15. An electronic connector, comprising; anelectronic device comprising: a non-conducting base body comprising atleast one side wall, wherein a portion of said base body defines atleast one recess disposed at least partly within said base body, aplurality of lead channels formed in at least a portion of said at leastone side wall and at least one retention element disposed in at leastone of said plurality of lead channels; at least one electroniccomponent disposed in said at least one recess, said electroniccomponent having a plurality of wire leads, at least one of saidplurality of wire leads extending within at least one of said pluralityof lead channels; a plurality of insertable lead terminals, wherein eachlead terminal comprises a first portion which is received within arespective one of said plurality of lead channels, forming a conductivecontact with one of said plurality of wire leads, and a second portionsubstantially parallel with the side wall; a modular plug comprising anRJ type connector and a cavity for receiving the electronic device,wherein when said electronic device is inserted into said cavity,deflection of the second portions of the lead terminals against the sidewall maintain said electronic device securely in said cavity.
 16. Theelectronic connector of claim 15, wherein the first portion of each leadterminal comprises a clip region, said clip region forming a shapeenabling said clip region to frictionally connect said lead terminal tothe respective lead channel.
 17. The electronic connector of claim 16,wherein the clip region is formed substantially of a U-shaped bend inthe lead terminal.
 18. The electronic connector of claim 17, wherein atleast one of the lead terminals secures at least one wire lead in therespective lead channel.
 19. The electronic connector of claim 18,wherein the base body further defines at least one chamfered notchdisposed within the base body, said at least one chamfered notchproviding a passage between an inner side of the at least one side walland an outer side of the side wall, said chamfered notch adapted toreceive at least one of the wire leads.
 20. An electronic device,comprising: a non-conducting base body having: at least one side wall; aportion of the base body defining at least one recess disposed at leastpartly within the base body; a portion of the at least one side walldefining a plurality of lead channels formed in at least a portion ofthe side wall; at least one retention element disposed in said pluralityof lead channels comprising at least one projection, said projectionreducing the cross-sectional area of the respective lead channel; aportion of the at least one side wall defining at least one chamferednotch providing a passage between an inner side of the side wall and anouter side of the side wall, at least one electronic component disposedin said at least one recess, said electronic component having aplurality of wire leads, at least one of said plurality of wire leadsextending within at least one of said plurality of lead channels andthrough at least one of said plurality of chamfered notches; and aplurality of insertable lead terminals received within respective onesof said plurality of lead channels, wherein each of the lead terminalscomprises a clip region with substantially a U-shape, said U-shape shapeenabling said clip region to frictionally connect said lead terminal tothe respective lead channel at least one of said lead terminals forminga conductive contact with said at least one of said plurality of wireleads, wherein at least one of said lead terminals secures at least onewire lead in the respective lead channel; wherein the movement of saidlead terminals within said plurality of lead channels is restricted bysaid retention elements.
 21. An electronic device, comprising: anon-conducting base body having: at least one side wall; a portion ofthe base body defining at least one recess disposed at least partlywithin the base body; a portion of the at least one side wall defining aplurality of lead channels formed in the side wall; at least oneelectronic component disposed in said at least one recess, saidelectronic component having a plurality of wire leads, at least one ofsaid plurality of wire leads extending within at least one of saidplurality of lead channels; a plurality of insertable lead terminalsreceived within respective ones of said plurality of lead channels,means for communicating the lead wire from an inner side of the at leastone side wall and an outer side of the side wall; and means for securingthe lead terminals within the lead channels.
 22. A method ofmanufacturing an electronic device, comprising: forming athree-dimensional base member having at least one electronic componentrecess and a plurality of lead channels, said lead channels having afirst shape; forming an electronic component having wire leads; forminga plurality of lead terminals, said lead terminals having a second shapeadapted to cooperate with said first shape of said lead channels;disposing said electronic component in said recess; routing at least oneof the wire leads into at least one of said lead channels; mating saidlead terminals within said lead channels, such that said first shapecooperates with said second shape to restrict the movement of said leadterminals within said lead channels.
 23. The method of claim 22, whereinthe acts of forming a plurality of lead terminals comprises the act offorming a unitary lead frame having said pluralities of lead terminalsdisposed thereon.
 24. The method of claim 23, wherein the act of formingsaid lead frame comprises the act of stamping said lead frame from asheet of metal.
 25. The method of claim 24, wherein the act of matingsaid lead terminals and said lead channels is performed while said leadterminals are disposed on the lead frame.
 26. The method of claim 23,further comprising separating the lead terminals from the lead frame.27. The method of claim 22, further comprising the act of exposing atleast a portion of said electronic device to solder in order to bond atleast some of said lead terminals to said wire leads of said electroniccomponent.
 28. The method of claim 22, further comprising encapsulatingat least a portion of said electronic device using a molding process.